Industrial components have to perform difficult task effectively. It, therefore, is necessary to make them strong with perfect shapes. Dicing and cutting are responsible for effectiveness and durability of your industrial parts. Select the best silicon wafer dicing services to ensure you get the quality products. Silicon wafer dicing is sometimes, referred to as the wafer dicing. However, it can be used for dicing on any material. Dicing and cutting are two important jobs need to be done with utmost care. Even a minor mistake can deteriorate the quality of the parts.
What you need to do is just tell the engineers providing dicing services about specifications you need. They provide affordable services according to customers’ requirements within their budget. They utilize the best technology to create bevel cut. Bevel cutting is used to create a v groove or a chamfer in the substrate. But there are some issues with it. While taking services of dicing, you should consider the following points.
- Tape does not support the bottom side of the substrate perfectly thereby resulting in bottom side chips of unusual shapes.
- Wax mounting the substrate on glass provides significant bottom side support, making less chipping. The problem with wax mounting is that the final dices are hard to take off and clean.