The dicing process can be accomplished by silicon wafer dicing services. All methods are typically automated to make sure high level of precision and accuracy. Following the dicing process, the individual silicon chips are encapsulated into chip carriers which are then ready to use in making electronic devices such as computers, etc.
Unlike earlier times, when people used to do heavy mechanical jobs on by themselves by using our their hands, nowadays with the help of advanced machines and equipment, there is no need for putting so much effort. In ceramic industry as well, the labourers in earlier days used to cut the wafer with their hands and by putting in so much of time and effort. But now, various devices like wafer dicing machines have come up which have made not only machining but its services such as dicing, slicing etc. also much easier.